HESSOPLAST
- complete series of pretreatment processes for the plating of plastics
- very economic and efficient processes for the plating of ABS and ABS / PC
HESSOPLAST PF (pre - cleaning and pickling)
- PFOS-free wetting agent
- developed for the pre - cleaning of plastic parts
- applicable in pickling solutions
HESSOPLAST R (reduction)
- free from sodium bi- / di-sulfites
- no unpleasant odour
- very good compatibility with our activator
HESSOPLAST AK (activator for 1 and 2K parts)
- highly effective activator for one and multi-component parts
- excellent stability although with very low tin contents of less than 2 g/L
HESSOPLAST BS (accelerator for 1K parts)
- fluoride – free accelerator for 1K parts
- independent of the immersion time no Pd removals
HESSOPLAST BS-200 (accelerator for multi-component parts)
- fluoride – free accelerator for multi-component parts
- optimized for our HESSONIC PL-AF (ammonia – free electroless Ni –system)
HESSONIC PL-AF (ammonia – free electroless Nickel process)
- ammonia – free electroless Nickel process
- very high stability
- very broad pH- and temperature operating range
- even suitable for immersion times of more than 6 minutes
- based on our thoroughly chosen combination there are no negative effects from the drag-in of HESSOPLAST BS-200
HESSOPLAST PC (immersion copper)
- immersion copper for the electroless Nickel layer to achieve an improvement of the conductivity
Reduction of the risks of not-plated areas as well as of blow-off due to current flow